halbleiteranordnung with improved connections between the chip and the head, and manufacturing method for it

摘要

A chip of semiconductor material (13) is fixed to a supporting area of a film of insulating material (12). Electrical interconnecting elements (18, 20, 21) join metallized areas (17) of the chip (13) to the ends of metal strips (11) which form the terminals of the device. To obtain devices with numerous terminals without approaching the dimensional limits imposed by the manufacture of the terminal frames, the interconnecting elements (18, 20, 21) comprise electrically conductive tracks (18) formed on the film of insulating material (12). The electrical connection between the ends of the terminals (11) and the tracks (18) is made by means of strips (20) of anisotropic conductive material. IMAGE