首页> 外国专利> Overlay mark designing method, e.g. for semiconductor device, involves illuminating overlay mark with probe beam, and measuring diffraction resulting from interaction of probe beam and overlay mark

Overlay mark designing method, e.g. for semiconductor device, involves illuminating overlay mark with probe beam, and measuring diffraction resulting from interaction of probe beam and overlay mark

机译:重叠标记设计方法,例如用于半导体器件,涉及用探测光束照射覆盖标记,并测量由探测光束和覆盖标记相互作用产生的衍射

摘要

Overlay mark designing method involves illuminating an overlay mark with a probe beam, and measuring a diffraction resulting from an interaction of the probe beam and overlay mark. Parameters of the overlay mark are selected and optimized to measure sensitivity of overlay measurement. An optimization algorithm is used to optimize the parameters of the overlay mark, which creates the sensitivity of overlay measurement.
机译:覆盖标记设计方法包括用探测光束照射覆盖标记,并测量由探测光束和覆盖标记的相互作用引起的衍射。选择并优化覆盖标记的参数以测量覆盖测量的灵敏度。优化算法用于优化重叠标记的参数,从而创建重叠测量的灵敏度。

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