METHOD FOR CALCULATING THERMAL RESISTANCE VALUE OF SEMICONDUCTOR PACKAGE, AND THERMAL RESISTANCE VALUE CALCULATING PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a method for calculating the thermal resistance value of a semiconductor package where a systematic error caused by how to select a thermal resistance model for finding a composite thermal resistance value is removed.;SOLUTION: The method for calculating the thermal resistance value of a semiconductor package includes a step S4 that calculates a composite thermal resistance value Rtotal (1) of between a semiconductor chip 1 to an atmosphere 99 obtained on each of a plurality of semiconductor packages and a thermal resistance value θja (2) corresponding to a composite resistance value Rtotal (2) of between the semiconductor chip and the atmosphere obtained on a first semiconductor package that is an object, using the formula showing a correlation with a thermal resistance value θja (1) of between the semiconductor chip and the atmosphere obtained on each of a plurality of the semiconductor packages: θja (1)=f (Rtotal (1)).;COPYRIGHT: (C)2008,JPO&INPIT