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ELECTRICAL CONNECTION STRUCTURE, INSULATING MEMBER WITH WIRING AND PRODUCTION METHOD OF THE SAME AND ELECTRONIC DEVICE

机译:电气连接结构,将导线绝缘的部件及其制造方法和电子设备

摘要

PROBLEM TO BE SOLVED: To provide an electrical connection structure capable of effectively suppressing the diffusion of a component (e.g. nickel) contained in a base plating layer to a surface plating layer to improve the connection stability and reliability of the surface plating layer to a conductive connection material and to improve repairing property.;SOLUTION: In an insulating member 30 with wiring which is formed by laminating and forming the base plating layers 35, 36 and the surface plating layers 37, 38 on the prescribed parts of wiring layers 31, 32 formed in the insulating member 30, the whole of surface layers 35B, 36B where the base plating layers 35, 36 is contact with the surface plating layers 37, 38 has a solid solution containing at least nickel and one of cobalt and iron.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种电连接结构,该电连接结构能够有效地抑制基底镀层中所含的成分(例如镍)向表面镀层的扩散,从而提高表面镀层与导电体的连接稳定性和可靠性。解决方案:在具有布线的绝缘构件30中,该绝缘构件30是通过在布线层31、32的规定部分上层压并形成基底镀层35、36和表面镀层37、38而形成的在绝缘构件30中形成的基底层35、36与表面层37、38接触的整个表面层35B,36B具有至少包含镍以及钴和铁中的一种的固溶体。 :(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP2007063633A

    专利类型

  • 公开/公告日2007-03-15

    原文格式PDF

  • 申请/专利权人 KYOCERA CORP;

    申请/专利号JP20050252905

  • 发明设计人 ISHIBASHI TORU;SATO EIJI;SATO HIDEAKI;

    申请日2005-08-31

  • 分类号C25D7/00;C25D5/50;C23C30/00;C23C18/50;H01L21/60;H05K1/09;H05K3/24;

  • 国家 JP

  • 入库时间 2022-08-21 21:14:40

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