Topic Solutions The waffle pack device which includes the component where the cavity in order at least to accommodate the die/di from one semiconductor wafer was formed to the surface. The component the semiconductor wafer handling device and (or) conforms to semiconductor wafer processing. It is desirable, the component the die/di from the semiconductor wafer accommodates majority at least. In addition, you remove the die/di from one waffle pack device, arrange this die/di to on the semiconductor package and you form all die/di parts which are necessary for the integrated circuit from the die/di which is arranged connecting the die/di which is arranged inside the semiconductor package mutually, you form the integrated circuit, method of the semiconductor device assembly is offered. At least, you remove the die/di from one waffle pack device, arrange this die/di to on the semiconductor package and you assemble the die/di equipment component which is necessary for the integrated circuit from the die/di which is arranged connecting the die/di which is arranged inside the semiconductor package mutually, you form the integrated circuit, method of another semiconductor device assembly is offered. Selective figure Figure 1A
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