FORMING METHOD OF BUMP, MANUFACTURING METHOD OF IMAGE SENSOR USING FORMING METHOD, AND SEMICONDUCTOR CHIP AND IMAGE SENSOR FORMED BY MANUFACTURING METHOD

摘要

PPROBLEM TO BE SOLVED: To provide a forming method of a bump, a manufacturing method of an image sensor using this forming method, and a semiconductor chip and an image sensor formed by this manufacturing method. PSOLUTION: The forming method of a bump, the manufacturing method of an image sensor using this forming method, and the semiconductor chip and the image sensor formed by this manufacturing method are provided. According to the method of forming the bump, the bump is formed in an electroplating process by using a conductive pad with a seed film. The conductive pad is thus used with the seed film, and therefore forming of an additional aluminum pad and seed film is eliminated, thus making it possible to simplify the process. In addition, the conductive pad and the bump are formed by the same substance, and therefore the process can be simplified by using a single substance. PCOPYRIGHT: (C)2007,JPO&INPIT