首页> 外国专利> DEVICE AND METHOD FOR PROVIDING UNIFORM AXIAL LOAD DISTRIBUTION WHEN LAMINATING LAYERS OF MULTILAYER CERAMIC CHIP CARRIER (METHOD AND DEVICE FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION WHEN LAMINATING LAYERS OF MULTILAYER CERAMIC CHIP CARRIER)

DEVICE AND METHOD FOR PROVIDING UNIFORM AXIAL LOAD DISTRIBUTION WHEN LAMINATING LAYERS OF MULTILAYER CERAMIC CHIP CARRIER (METHOD AND DEVICE FOR PROVIDING UNIAXIAL LOAD DISTRIBUTION WHEN LAMINATING LAYERS OF MULTILAYER CERAMIC CHIP CARRIER)

机译:层叠多层陶瓷芯片载体时提供均匀轴向载荷分布的装置和方法(多层陶瓷芯片载体分层时提供轴向载荷分布的方法和装置)

摘要

PROBLEM TO BE SOLVED: To provide a device for providing a uniform axial load distribution when laminating layers of a multilayer ceramic chip carrier.;SOLUTION: The device comprises a base plate 1201 configured so as to support a plurality of green sheet layers from under. The base plate has at least one elastically-attached load support bar 1202 arranged adjacent to the outer edge thereof. The load support bar is attached onto one or more biasing members so that the upper surface of the load support bar can extend as far as a selected distance on the upper surface of the base plate.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种用于在层叠多层陶瓷芯片载体的层时提供均匀的轴向载荷分布的装置。解决方案:该装置包括基板1201,该基板1201构造成从下方支撑多个生片层。基板具有至少一个弹性附接的负载支撑杆1202,该负载支撑杆1202邻近其外边缘布置。负载支撑杆连接到一个或多个偏置构件上,以便负载支撑杆的上表面可以在基板的上表面上延伸到选定的距离。;版权所有:(C)2007,JPO&INPIT

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