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PACKAGE FOR ELASTIC SURFACE WAVE OSCILLATOR, AND THE ELASTIC SURFACE WAVE OSCILLATOR USING THE SAME
PACKAGE FOR ELASTIC SURFACE WAVE OSCILLATOR, AND THE ELASTIC SURFACE WAVE OSCILLATOR USING THE SAME
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机译:弹性表面波振荡器的封装,以及使用相同封装的弹性表面波振荡器
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摘要
PROBLEM TO BE SOLVED: To provide a package for elastic surface wave oscillators that can arrange electric connection at each of components certainly, even if the stray capacitance becomes smaller, while attaining miniaturization.;SOLUTION: The package comprises a thin bottom 24 and a thick bottom 26. The thin bottom 24 comprises a region on which an electronic component 42 is mounted. The thick bottom 26 has a thicker dimension compared with the thin bottom 24, and comprises an element-bonding region where a surface acoustic wave element 30 is jointed by using adhesives 40. The thick bottom 26 comprises also a pad 44 electrically connected to the electronic component 42 by a bonding wire 46. In addition, a convex part 48 is arranged at the thick bottom 26 for separating the element-bonding region from a wire joint 44a, where a bonding wire of the pad 44 is connected.;COPYRIGHT: (C)2007,JPO&INPIT
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