首页> 外国专利> PACKAGE FOR ELASTIC SURFACE WAVE OSCILLATOR, AND THE ELASTIC SURFACE WAVE OSCILLATOR USING THE SAME

PACKAGE FOR ELASTIC SURFACE WAVE OSCILLATOR, AND THE ELASTIC SURFACE WAVE OSCILLATOR USING THE SAME

机译:弹性表面波振荡器的封装,以及使用相同封装的弹性表面波振荡器

摘要

PROBLEM TO BE SOLVED: To provide a package for elastic surface wave oscillators that can arrange electric connection at each of components certainly, even if the stray capacitance becomes smaller, while attaining miniaturization.;SOLUTION: The package comprises a thin bottom 24 and a thick bottom 26. The thin bottom 24 comprises a region on which an electronic component 42 is mounted. The thick bottom 26 has a thicker dimension compared with the thin bottom 24, and comprises an element-bonding region where a surface acoustic wave element 30 is jointed by using adhesives 40. The thick bottom 26 comprises also a pad 44 electrically connected to the electronic component 42 by a bonding wire 46. In addition, a convex part 48 is arranged at the thick bottom 26 for separating the element-bonding region from a wire joint 44a, where a bonding wire of the pad 44 is connected.;COPYRIGHT: (C)2007,JPO&INPIT
机译:要解决的问题:提供一种用于弹性表面波振荡器的封装,即使杂散电容变小,同时也可以实现各个组件之间的电连接,同时实现小型化;解决方案:该封装包括薄的底部24和厚的底部底部26。薄底部24包括其上安装电子部件42的区域。厚底26与薄底24相比具有更大的尺寸,并且包括元件结合区域,在该元件结合区域中,表面声波元件30通过使用粘合剂40而接合。厚底26还包括电连接至电子设备的焊盘44。另外,在厚底26上设置有凸部48,该凸部48用于将元件接合区域与连接焊盘44的接合线的引线接合部44a隔开。 C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007060362A

    专利类型

  • 公开/公告日2007-03-08

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20050243937

  • 发明设计人 TAKEBAYASHI YUICHI;

    申请日2005-08-25

  • 分类号H03B5/30;

  • 国家 JP

  • 入库时间 2022-08-21 21:09:58

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