Thermal analysis method, thermal design support method, program, recording medium, apparatus for performing thermal analysis, thermal design support apparatus for a

摘要

PROBLEM TO BE SOLVED: To provide a variable analysis method for a multivariable structure and a thermal design support method that can precisely accelerate an analysis of a connection structure in a circuit board 1 having thereon a plurality of electronic devices 2 with a variable of heat or the like, for each of the interactive variables.;SOLUTION: An analysis object depending on each electronic device and circuit board is divided and modeled into a plurality of sub analysis modules. Boundary conditions of the modeled sub analysis modules are decided so that variable values contradictory between sub analysis modules become given values or smaller with distribution factors showing influence rates on other interactive variable values, with the result that connection structures of each variable are analyzed.;COPYRIGHT: (C)2004,JPO&NCIPI