3,3 ' and 4,4 ' the - benzophenone tetracarboxylic dianhydride (

摘要

PROBLEM TO BE SOLVED: To provide an adhesive basic material with a heat radiation plate, having a thermoplastic polyimide superior in moist heat resistance (heat resistance after water absorption), which fixes a front edge of a lead frame.;SOLUTION: In a lead frame fixing adhesive basic material with the heat radiation plate in which a non-thermoplastic polyimide layer and a thermoplastic polyimide layer are laminated in this order, or only the thermoplastic polyimide layer is laminated on one surface of a metal plate acting as the heat radiation plate. For the adhesive basic material, a material containing a 4, 4'-bis (3-aminophenoxy) biphenyl (hereinafter be occasionally abbreviated as m-BP) as a diamine component of a resin forming the thermoplastic polyimide layer, and 3, 3', 4, 4'-benzophenone tetracarboxylic acid dianhydride (hereinafter be occasionally abbreviated as BTDA) as a tetracarboxylic acid dianhydride component, is used. A molar ratio used (BTDA/m-BP) is 1.005-1.070.;COPYRIGHT: (C)2005,JPO&NCIPI