Production manner of the substrate for ink jet record and the substrate for the ink jet recording head, to possess the heat energy generation component which generates the ink jet recording head, and the

摘要

PROBLEM TO BE SOLVED: To efficiently cool an inkjet recording head by ink.;SOLUTION: An oxide film H1112 of a wafer rear face is patterned, whereby an ink supply port H1102 is formed in an Si substrate H1101 from an opening H1114 of the oxide film by anisotropic etching with the use of TMAH. An Al sacrifice layer H1110 part higher in the etching rate than the Si substrate H1101 is rapidly etched by a speed of several times to an Si part. The ink supply port H1102 is opened up to the Si substrate H1101 surface. Anisotropic etching is stopped at a time point when the ink supply port H1102 is opened. Thus an Si thin film part H1108 of a thickness t₁ is formed at a part immediately below a heating resistor H1103.;COPYRIGHT: (C)2005,JPO&NCIPI