首页> 外国专利> As formation manner of the aluminum electrolytic condenser, the temporary bend dies, the Interpolation it makes through the lead/read terminal the Interpolation through-hole of the production mannered null insulating seat board

As formation manner of the aluminum electrolytic condenser, the temporary bend dies, the Interpolation it makes through the lead/read terminal the Interpolation through-hole of the production mannered null insulating seat board

机译:作为铝电解电容器的形成方式,临时弯曲模具,其通过引线/读取端子进行的插补是生产出的零绝缘座板的插补通孔

摘要

A primary die 122 moves up with an insulating washer 12 and slightly bends terminal chips 10b of an aluminum electrolytic condenser 10 on the instant the chips 10b go through holes 12a of the washer 12. Therefore, it is unnecessary to attach the washer 12 on the chips 10b. Further, since the primary die 122 slightly bends the chips 10b on the instant the chips 10b go through the holes 12a, the stroke of the primary die 122 is shorter than the one in the prior art and the primary die 122 can bend the chips 10b in a short time.
机译:一次模具122与绝缘垫圈12一起向上移动,并在铝电解电容器10的端子芯片10b穿过垫圈12的孔12a时使铝电解电容器10的端子芯片10b略微弯曲。因此,不必将垫圈12安装在垫圈12上。筹码10b。此外,由于当芯片10b穿过孔12a时,一次模具122使芯片10b稍微弯曲,所以一次模具122的行程比现有技术中的短,并且一次模具122可以使芯片10b弯曲。短时间内。

著录项

  • 公开/公告号JP3880817B2

    专利类型

  • 公开/公告日2007-02-14

    原文格式PDF

  • 申请/专利权人 ハイメカ株式会社;

    申请/专利号JP20010253923

  • 发明设计人 村上 定秀;

    申请日2001-08-24

  • 分类号H01G13/00;H01G9/008;H01G9/00;H01G9/004;

  • 国家 JP

  • 入库时间 2022-08-21 21:08:51

相似文献

  • 专利
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号