Plated preprocessing liquid and plated preprocessing manner

摘要

A plating-pretreatment solution comprising an organic sulfonic acid, thiourea, fluoroboric acid and hypophosphorous acid and a plating-pretreatment method comprising contacting a film carrier tape in which a wiring pattern is formed ON a surface of an insulating film with a plating-pretreatment solution comprising an organic sulfonic acid, thiourea and fluoroboric acid and hypophosphorous acid to remove metals remaining ON the insulating film. According to the plating-pretreatment solution and the plating-pretreatment method, metals remaining ON the surface of the insulating film exposed by etching are removed and the occurrence of migration is prevented.