The constituent for silica type coat formation, production manner and electronic parts null of silica type

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming a silica-based film whereby a silica-based film can be readily prepared with sufficient mechanical strength, a sufficiently low dielectric property, high adhesion to a silicon wafer, and high electrical reliability in some cases.;SOLUTION: The composition for forming the film comprises (a) a siloxane resin obtained by hydrolyzing and condensing a compound expressed by the following general formula (1) (where, R¹ represents H or F or a group containing B, N, Al, P, Si, Ge, or Ti, or an organic group having a carbon number of 1 to 20 that may be the same or different, X represents a hydrolyzable group which may be the same or different, and n represents an integer of 0, 1, or 2), and (b) a carbodiimide.;COPYRIGHT: (C)2003,JPO