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LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN
LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN
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机译:低介电损耗树脂,树脂组成以及低介电损耗树脂的制造方法
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摘要
An object of the present invention is to provide a low dielectric loss resin composition with a narrow molecular weight distribution, the resin composition suffering as low a dielectric loss as that of commercially available polyphenylenether, being soluble in a general-purpose solvent with a low boiling point, and being easily processed into a wiring board. The present invention provides a thermosetting low dielectric loss resin which is a random copolymer of polyphenylenether having an unsaturated bond in a side chain and which has a molecular weight distribution of less than 10, more preferably at most 5, particularly preferably at most 3, as well as the hardened resin, a resin composition and an electronic part containing the resin, and a synthesizing method for obtaining the resin.
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