APPROACHING PROGRAMMABLE SELF-ASSEMBLY: HETEROGENEOUS INTEGRATION OF CHIP-SCALE COMPONENTS ON PLANAR AND NON-PLANAR SURFACES

摘要

A method of self-assembly of components on a surface of a substrate includes obtaining a first component and a second component. The first component type is assembled onto the substrate by programming the surface. The second component type is assembled by reprogramming the surface. A third component, next to the first and second components, is assembled following the step of assembling the first and second components. The first, second, and third components are all different types of components. docking sites on the substrate can be used that contain alignment pedestals. One component delivery system employ a liquid-liquid interface to deliver and concentrate components with correct pre-orientation.