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TILE BACK-STAMP DESIGN AND METHOD OF MANUFACTURE OF TILE/SUBSTRATE SYSTEM
TILE BACK-STAMP DESIGN AND METHOD OF MANUFACTURE OF TILE/SUBSTRATE SYSTEM
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机译:瓷砖/基体系统的瓷砖倒缝设计和制造方法
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摘要
A tile has a back-stamp design including a recessed network of channels including intersecting interior channels that traverse in a plurality of directions across the back-stamp design. The perimeter of the back-stamp design is traversed by a raised border, and a plurality of plateaus define the interior channels therebetween. The raised border and the plateaus both extend from the depth of the recessed network of channels to a common outer plane. A plurality of the tiles can be bonded to a substrate to produce a multi-tile panel that can then be installed, e.g., as flooring.
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