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TILE BACK-STAMP DESIGN AND METHOD OF MANUFACTURE OF TILE/SUBSTRATE SYSTEM

机译:瓷砖/基体系统的瓷砖倒缝设计和制造方法

摘要

A tile has a back-stamp design including a recessed network of channels including intersecting interior channels that traverse in a plurality of directions across the back-stamp design. The perimeter of the back-stamp design is traversed by a raised border, and a plurality of plateaus define the interior channels therebetween. The raised border and the plateaus both extend from the depth of the recessed network of channels to a common outer plane. A plurality of the tiles can be bonded to a substrate to produce a multi-tile panel that can then be installed, e.g., as flooring.
机译:瓷砖具有后戳设计,其包括凹入的通道网络,该凹入网络包括相交的内部通道,该内部通道在多个方向上横穿后戳设计。后盖设计的周边被一个凸起的边界横越,并且多个平台在它们之间限定了内部通道。凸起的边界和平台都从通道的凹陷网络的深度延伸到公共的外部平面。可以将多个砖粘合到基底上,以产生多层地板,然后可以将其安装,例如作为地板。

著录项

  • 公开/公告号US2007251172A1

    专利类型

  • 公开/公告日2007-11-01

    原文格式PDF

  • 申请/专利权人 TODD CRAMER;SCOTT KIESTER;

    申请/专利号US20070740436

  • 发明设计人 SCOTT KIESTER;TODD CRAMER;

    申请日2007-04-26

  • 分类号E04F13/08;

  • 国家 US

  • 入库时间 2022-08-21 21:05:48

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