providing a first component 1 with first pads 3 for accommodating protrusions, providing a second component 2 with second pads 5 for accommodating protrusions, the first pads 3 and second pads 5 respectively being intended to line up two by two in order to form pairs of pads, then providing the first pads and/or second pads with protrusions 4 made of a fusible material, then placing the first and second components one on top of the other, then bringing the assembly consisting of the first and second components and consequently the solder protrusions to a soldering temperature in order to interconnect the first and second pads of each pair of pads by soldering the protrusions to these pads, and finally, cooling down the soldered joint thus obtained. ;Some of the protrusions 4 of fusible material fitted on the first and/or second pads 3 and 5 respectively consist of at least three larger-sized protrusions 6, especially taller protrusions, so that before the temperature is increased to the hybridisation temperature, the component only rests on the larger protrusions."/> Method for hybridisation of two components by using different sized solder protrusions and a device that uses two components hybridised according to this method
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Method for hybridisation of two components by using different sized solder protrusions and a device that uses two components hybridised according to this method

机译:通过使用大小不同的焊料突起来使两个组件混合的方法以及使用根据该方法混合的两个组件的设备

摘要

The hybridisation method involves: providing a first component 1 with first pads 3 for accommodating protrusions, providing a second component 2 with second pads 5 for accommodating protrusions, the first pads 3 and second pads 5 respectively being intended to line up two by two in order to form pairs of pads, then providing the first pads and/or second pads with protrusions 4 made of a fusible material, then placing the first and second components one on top of the other, then bringing the assembly consisting of the first and second components and consequently the solder protrusions to a soldering temperature in order to interconnect the first and second pads of each pair of pads by soldering the protrusions to these pads, and finally, cooling down the soldered joint thus obtained. ;Some of the protrusions 4 of fusible material fitted on the first and/or second pads 3 and 5 respectively consist of at least three larger-sized protrusions 6, especially taller protrusions, so that before the temperature is increased to the hybridisation temperature, the component only rests on the larger protrusions.
机译:杂交方法包括: 通过第一垫 3 提供第一组件 1 >用于容纳突起, 为第二个组件 2 提供第二个垫块 5 用于容纳突起, 第一个打击垫 3 和第二个打击垫 5 分别旨在通过 然后为两个焊盘形成一对,然后为第一和/或第二个焊盘提供凸起 4 一种易熔材料,然后将第一组件和第二组件彼此叠放,然后将由第一组件和第二组件以及焊料突起组成的组件置于焊接温度下,以便互连每对的第一焊盘和第二焊盘通过将突起焊接到这些焊盘上来形成焊盘,冷却由此获得的焊接点。 ;安装在第一和/或第二个焊盘 3 5 上的易熔材料的某些凸起 4 分别由至少三个较大的突出物 6 组成,尤其是较高的突出物,因此在温度升高到杂交温度之前,组件仅停留在较大的突出物上。

著录项

  • 公开/公告号US2007045387A1

    专利类型

  • 公开/公告日2007-03-01

    原文格式PDF

  • 申请/专利权人 FRANCOIS MARION;

    申请/专利号US20060495214

  • 发明设计人 FRANCOIS MARION;

    申请日2006-07-28

  • 分类号B23K31/02;

  • 国家 US

  • 入库时间 2022-08-21 21:03:46

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