首页> 外国专利> Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle

Treating solution supply nozzle, a substrate treating apparatus having this nozzle, and a method of manufacturing a treating solution supply nozzle

机译:处理液供给喷嘴,具有该喷嘴的基板处理装置以及处理液供给喷嘴的制造方法

摘要

A resin block has a treating solution channel extending between and opening at front and back surfaces thereof. Heat conductive members are face-bonded to the front and back surfaces of the resin block, respectively, for closing the channel. Consequently, no air is present between the resin block and heat conduction members, thereby improving the efficiency of heat exchange. A nozzle of simple construction is realized only by face-bonding the two heat conductive members to the open front and rear surfaces of the resin block. Temperature control plates hold the heat conductive members along with the resin block to effect a temperature control, whereby the temperature of a treating solution in the treating solution channel is controlled effectively through the heat conductive members. The treating solution adjusted to a desired temperature is delivered from a discharge opening to a substrate for performing substrate treatment with high accuracy.
机译:树脂块具有在其前表面和后表面之间延伸并在其前表面和后表面开口的处理溶液通道。导热构件分别面接合至树脂块的前表面和后表面,以封闭通道。因此,在树脂块和导热构件之间不存在空气,从而提高了热交换效率。仅通过将两个导热构件面接合到树脂块的敞开的前表面和后表面,就可以实现结构简单的喷嘴。温度控制板将导热构件与树脂块保持在一起以进行温度控制,从而通过导热构件有效地控制处理液通道中的处理液的温度。调节至期望温度的处理液从排出口输送至基板,以高精度进行基板处理。

著录项

  • 公开/公告号US7267723B2

    专利类型

  • 公开/公告日2007-09-11

    原文格式PDF

  • 申请/专利权人 SHIGEHIRO GOTO;HIROSHI KOBAYASHI;

    申请/专利号US20040836146

  • 发明设计人 SHIGEHIRO GOTO;HIROSHI KOBAYASHI;

    申请日2004-04-30

  • 分类号B05B7/16;B05C11/00;

  • 国家 US

  • 入库时间 2022-08-21 21:03:35

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