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Method of forming SI tip by single etching process and its application for forming floating gate

机译:单蚀刻工艺形成硅电极头的方法及其在浮栅形成中的应用

摘要

The invention provides a method of forming a silicon tip by a single etching process, as well as a method of forming a tip floating gate to increase erase speed. Etching gases comprising (1) chlorine and/or (2) oxygen/helium are performed to form a silicon tip without bottom dimple. The invention may further control the tip angle by adjusting the etching parameters of gas compositions and ratios, chamber pressures, and radio frequency powers.
机译:本发明提供了一种通过单蚀刻工艺形成硅尖端的方法,以及形成尖端浮置栅极以提高擦除速度的方法。进行包含(1)氯和/或(2)氧/氦的蚀刻气体以形成没有底部凹痕的硅尖端。本发明可以通过调整气体成分和比例的蚀刻参数,腔室压力和射频功率来进一步控制尖端角。

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