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Enhancement of copper line reliability using thin ALD tan film to cap the copper line
Enhancement of copper line reliability using thin ALD tan film to cap the copper line
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机译:使用薄ALD棕褐色膜覆盖铜线以提高铜线可靠性
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摘要
A method for depositing a cap layer over a metal-containing interconnect is provided. In one aspect, the cap layer is formed by introducing a pulse of a metal-containing compound followed by a pulse of a nitrogen-containing compound. In one aspect, the cap layer comprises tantalum nitride. The cap layer provides good barrier and adhesive properties, thereby enhancing the electrical performance and reliability of the interconnect.
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