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Composition of bulk filler and epoxy-clay nanocomposite
Composition of bulk filler and epoxy-clay nanocomposite
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机译:填充料和环氧粘土纳米复合材料的组成
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摘要
A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nano-composite, and combining it with a bulk amount of a filler.
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