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Method and apparatus for determining the temperature of a junction using voltage responses of the junction and a correction factor
Method and apparatus for determining the temperature of a junction using voltage responses of the junction and a correction factor
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机译:使用结的电压响应和校正因子确定结的温度的方法和装置
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摘要
Method and system for periodically measuring the junction temperature of a semiconductor device. The junction is excited by at least two sequential predetermined currents of different magnitudes. The voltage response of the junction to the at least two currents is measured and the temperature of the junction is calculated, while substantially canceling ohmic effects, by using the voltage response and a correction factor. Whenever desired, the junction is excited by a set of at least four sequential different currents having known ratios. The voltage response to the set is measured and the correction factor is calculated by using each voltage response to the set.
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