首页> 外国专利> IMPROVEMENTS IN OR RELATING TO THE DEVELOPMENT OF ELECTROPLATING BATH FOR DEPOSITION OF HIGH TUNGSTEN NICKEL ALLOY ON CARBON STEEL SUBSTRATES

IMPROVEMENTS IN OR RELATING TO THE DEVELOPMENT OF ELECTROPLATING BATH FOR DEPOSITION OF HIGH TUNGSTEN NICKEL ALLOY ON CARBON STEEL SUBSTRATES

机译:在碳钢基体上沉积高钨镍合金的电镀浴的改进或与之相关的改进

摘要

In the present invention there is provided an electroplating bath and process for the deposition of high tungsten nickel alloy on carbon steel substrates, wherein the bath consists of nickel sulphate 40 gpl, sodium tungstate 40 to 120 gpl, sodium citrate 160 gpl, ammonium sulphate 160 gpl. The electroplating process is effected utilizing the above bath at pH of the order of 8 with stainless steel sheets as anodes and carbon steel as cathode at a current density of the order of 2.5 A/dm2, at a temperatue of the order of 30 degree C, to obtain deposits of about 90% tungsten containing nickel deposition on carbon steel substrates with acceptable lustre with 4 to 4.2 muA/cm2 corrosion current density in 3% Nacl solution.
机译:在本发明中,提供了用于在碳钢基底上沉积高钨镍合金的电镀浴和方法,其中该浴由硫酸镍40 gpl,钨酸钠40至120 gpl,柠檬酸钠160 gpl,硫酸铵160组成。 gpl。利用上述浴液在pH值约为8的条件下进行电镀,其中不锈钢板作为阳极,碳钢作为阴极,电流密度为2.5 A / dm2,温度为30摄氏度。 ,以在3%Nacl溶液中以4至4.2μA/ cm2的腐蚀电流密度在具有可接受光泽的碳钢基底上沉积约90%的含钨镍沉积物。

著录项

  • 公开/公告号IN2005DE00725A

    专利类型

  • 公开/公告日2007-01-12

    原文格式PDF

  • 申请/专利权人

    申请/专利号IN725/DEL/2005

  • 发明设计人 VARAGUR SWAMINATHAN MURALIDHARAN;

    申请日2005-03-31

  • 分类号C25D3/12;

  • 国家 IN

  • 入库时间 2022-08-21 20:58:14

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