A method and device for screening of enveloped electronic components during laser cutting.

摘要

The present invention relates to a method and a device for cutting with a laser beam of a substantially flat carrier provided with encapsulated electronic components, in particular with electronic components which are shielded by a metallized cover element, by mutual displacement of the laser beam and the carrier, wherein during laser cutting at least a part of the encapsulated electronic components is shielded on the side facing the laser beam by means of a masking element, a layer of film material, by a shielding layer applied before laser cutting by means of spraying or by a fabric. The present invention also relates to a method and a device for cutting with a laser beam of a substantially flat carrier provided with encapsulated electronic components, in particular with electronic components which are shielded by a metallized cover element, by mutual displacement of the laser beam and the carrier, wherein at least part of the encapsulated electronic components is cleaned on the side facing the laser beam by a contamination-discharging cleaning element after at least part of the laser cutting has taken place.