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JOINING AGENT FOR JOINING PARTS, METHOD FOR JOINING PARTS MADE OF A MATERIAL WITH A HIGH CONTENT OF SILICIC ACID WHILE USING THE JOINING AGENT, AND A BONDING OF PARTS THAT IS OBTAINED ACCORDING TO THE
JOINING AGENT FOR JOINING PARTS, METHOD FOR JOINING PARTS MADE OF A MATERIAL WITH A HIGH CONTENT OF SILICIC ACID WHILE USING THE JOINING AGENT, AND A BONDING OF PARTS THAT IS OBTAINED ACCORDING TO THE
In a known method for joining parts made of a material with a high content of silicic acid by integrally joining, an SiO2-containing joining compound is formed between joining surfaces of the parts. This joining compound comprises a chemical composition that is specific with regard to the material with a high content of silicic acid. Based on this, the aim of the invention is to enable a cost-effective production of a thermally stable bond. To this end, the formation of the SiO2-containing joining compound has the following method steps: (a) preparing an aqueous slip containing amorphous SiO2 particles; (b) forming a slip compound between the joining surfaces to be fixed to one another; (c) drying the slip compound, and; (d) hardening the slip compound by heating while forming the SiO2-containing joining compound. A bonding of parts produced according to the inventive method exhibits a high temperature stability and resistance to thermal shocks and can also be used for contamination-sensitive applications. The invention is characterized in that an SiO2-containing joining compound is provided that is produced from amorphous, sintered or vitrified SiO2 particles with particle sizes ranging up to 500 µm, the amorphous SiO2 particles having particle sizes ranging from 1 µm to 50 µm constituting the greatest volume percent.
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