首页>
外国专利>
THINNING OP A SI WAFER FOR MEMS-SENSORS APPLICATIONS
THINNING OP A SI WAFER FOR MEMS-SENSORS APPLICATIONS
展开▼
机译:针对MEMS传感器应用的OP SI SI WAFER的变薄
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for thinning a wafer layer to a predetermined thickness comprises two phases of thinning. A first thinning phase and a second thinning phase, wherein the first thinning phase is a preparatory thinning phase and the second thinning phase is a final thinning phase, so performed that the structure comprising silicon meets as thinned the final thickness as predetermined. Such thinned layer in a wafer for instance, can be used in a sensor to be used in normal sized, micromechanical or even nano-sized devices for the device specific sensing applications in electro-mechanical devices.
展开▼