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THICK CRACK-FREE SILICA FILM BY COLLOIDAL SILICA INCORPORATION

机译:胶体二氧化硅掺入的无裂纹厚二氧化硅膜

摘要

The invention relates to low temperature curable spin-on glass materials which are useful for electronic applications, such as optical devices, in particular for flat panel displays. A substantially crack-free silicon polymer film is produced by (a) preparing a composition comprising at least one silicon containing pre-polymer, colloidal silica, an optional catalyst, and optional water; (b) coating a substrate with the composition to form a film on the substrate, (c) crosslinking the composition by heating to produce a substantially crack-free silicon polymer film, having a thickness of from about 700 Å to about 20,000 Å, and a transparency to light in the range of about 400 nm to about 800 nm of about 90% or more.
机译:本发明涉及低温可固化的旋涂玻璃材料,其可用于电子应用,例如光学装置,特别是平板显示器。通过(a)制备包含至少一种含硅的预聚物,胶态二氧化硅,任选的催化剂和任选的水的组合物来生产基本上无裂纹的硅聚合物膜; (b)用组合物涂覆基底以在基底上形成膜,(c)通过加热使组合物交联以产生厚度为约700到约20,000的基本上无裂纹的硅聚合物膜,和对约400%至约800nm范围内的光的透明度为约90%或更高。

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