Process to fabricate a Tool Insert for Injection Moulding a two-level microstructured Piece

摘要

A silicon wafer (11) is given micro-structures on the leading side by plasma etching. The etching mask is removed. Openings are formed at the microstructures at both sides of the wafer. The etching mask is removed and the wafer is bonded to a carrier substrate (18) to form a master (19). Metal is deposited on the leading side of the wafer. The back (22) of the metal layer (21) is polished, and used as a mold insert for injection molding. To prepare a mold insert for injection molding a component with micro-structures, of plastics or metal or ceramic materials, a silicon wafer (11) is given micro-structures on the leading side by plasma etching to a given depth. The etching mask is removed, and micro structures are formed in the trailing side by plasma etching to shape hollows. Openings are formed at the microstructures at both sides of the wafer. The etching mask is removed and the wafer is bonded to a carrier substrate (18) of Pyrex (RTM) fireproof glass or a silicon wafer to form a master (19). Metal is deposited in an electrochemical action on the leading side of the wafer which also enters into the hollows at the trailing side. The back (22) of the metal layer (21) is polished, and then separated from the master to be used as a mold insert for injection molding.