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Aqueous solution for surface treatment of tin films and method for preventing discoloration of a tin film surface

机译:用于锡膜表面处理的水溶液和防止锡膜表面变色的方法

摘要

To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.
机译:提供一种具有良好的焊料润湿性并且防止热处理后锡膜的变色和扭曲的焊料镀膜。公开了一种用于表面处理锡膜的方法和溶液。该水溶液包含特定的化合物,并在回流处理锡膜之前使其与镀锡膜接触。

著录项

  • 公开/公告号EP1757715A2

    专利类型

  • 公开/公告日2007-02-28

    原文格式PDF

  • 申请/专利权人 ROHM AND HAAS ELECTRONIC MATERIALS LLC;

    申请/专利号EP20060254373

  • 发明设计人 ORIHASHI MASANORI;

    申请日2006-08-21

  • 分类号C25D5/48;

  • 国家 EP

  • 入库时间 2022-08-21 20:45:57

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