JIG FOR TESTING SEMICONDUCTOR CHIP AND METHOD OF TESTING SEMICONDUCTOR CHIP USING THE SAME

摘要

A semiconductor chip testing jig and a semiconductor chip testing method using the same are provided to perform easily a predetermined test on a front and rear surfaces according to the type of a defective chip and to transfer easily the heat to the defective chip. A semiconductor chip testing jig includes a supporting package, an infrared filter and a testing substrate. The supporting package includes a first cavity(142) for loading a semiconductor chip. The infrared filter(144) is fixed to the first cavity of the supporting package. The infrared filter is attached to a rear surface of the semiconductor chip. The testing substrate(130) includes a second cavity(134) for exposing the infrared filter to the outside. The testing substrate is used for loading the supporting package.