PRINTED-WIRING BOARD, MULTILAYER PRINTED-WIRING BOARD AND MANUFACTURING PROCESS THEREFOR

摘要

The present invention provides a printed-wiring board which can make the electric wiring densified and can be thinned, even when having a BVH of a non-penetration hole filled with a selectively plating, formed therein for interfacial connection means. The printed-wiring board has a blind via hole connecting different wiring-pattern-formed layers with each other, wherein the blind via hole is a non-penetration hole filled with a plating, and the plating is not formed on a wiring pattern including the round of the blind via hole. The process for manufacturing the printed-wiring board having a blind via hole connecting different wiring-pattern-formed layers with each other includes the steps of: sequentially layering at least a metallic foil and a barrier metal layer to be differently etched from the metallic foil, on an insulation layer; preparing such a non-penetration hole as to reach a desired wiring-pattern-forming layer, by directly irradiating the barrier metal layer with a laser beam; cleaning the inside of the non-penetration hole by desmearing treatment; filling the non-penetration hole with a plating, and at the same time forming a plating on the barrier metal layer, by plating treatment; removing the plating which has been formed on the barrier metal layer and protrudes from the non-penetration hole, by etching treatment; peeling the barrier metal layer; and etching the metallic foil to form a wiring pattern.