METHOD OF PACKAGING OF MEMS DEVICE AT THE VACUUM STATE USING A SILICIDE BONDING

摘要

A vacuum mounting method of a micro electro mechanical systems device using a silicide bonding is provided to prevent a leakage by performing a bonding at a low temperature. A vacuum mounting method of an MEMS(Micro Electro Mechanical Systems) device using a silicide bonding includes the steps of preparing a bottom silicon substrate where a silicon(100), an oxide layer(105), and another silicon(110) are simultaneously laminated, forming a metal layer, an amorphous silicon layer, and an adhering layer on the bottom silicon substrate, selectively etching the adhering layer, the amorphous silicon layer, and the metal layer to expose the bottom silicon substrate, forming the MEMS device inside of the bottom silicon substrate, arranging a top glass substrate, inside of a vacuum chamber, on which a cavity is formed on the bottom silicon substrate on which the MEMS device is formed, heat-treating top and bottom substrates, forming a first silicide by reacting the metal layer and the bottom silicon substrate, forming a second silicide by reacting the metal layer and the amorphous silicon layer, and adhering to the top and bottom substrates in a vacuum.