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MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS SUBSTRATE, MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS, ELECTRO-OPTICAL APPARATUS SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC INSTRUMENT
MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS SUBSTRATE, MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS, ELECTRO-OPTICAL APPARATUS SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC INSTRUMENT
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机译:光电仪器基板的制造方法,光电仪器,光电仪器基板,光电仪器和电子仪器的制造方法
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摘要
The present invention for removing a photosensitive resin to a shallow depth less than the thickness of the photosensitive resin in the concave portion, and manufacturing the electro-optical device substrate for leaving the photosensitive resin in the portion other than the concave portion, the electrooptic device substrate in a manufacturing process, first, a photosensitive resin coating 132 on the second substrate 120, as shown in Fig. 5 (a). Subsequently, Fig. 5 (b), it is carried out once the second exposure by the first reticle 145, as shown in to form the irregularities. Thereafter, at a portion other than the concave-convex part he should be removed to a depth of a photosensitive resin, and the film thickness, FIG. 5 (c), the exposure is performed twice in the second as the second reticle 148, as shown in. After performing the exposure two times, not subjected to development to form a layer (130).
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