首页> 外国专利> MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS SUBSTRATE, MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS, ELECTRO-OPTICAL APPARATUS SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC INSTRUMENT

MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS SUBSTRATE, MANUFACTURING METHOD OF ELECTRO-OPTICAL APPARATUS, ELECTRO-OPTICAL APPARATUS SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC INSTRUMENT

机译:光电仪器基板的制造方法,光电仪器,光电仪器基板,光电仪器和电子仪器的制造方法

摘要

The present invention for removing a photosensitive resin to a shallow depth less than the thickness of the photosensitive resin in the concave portion, and manufacturing the electro-optical device substrate for leaving the photosensitive resin in the portion other than the concave portion, the electrooptic device substrate in a manufacturing process, first, a photosensitive resin coating 132 on the second substrate 120, as shown in Fig. 5 (a). Subsequently, Fig. 5 (b), it is carried out once the second exposure by the first reticle 145, as shown in to form the irregularities. Thereafter, at a portion other than the concave-convex part he should be removed to a depth of a photosensitive resin, and the film thickness, FIG. 5 (c), the exposure is performed twice in the second as the second reticle 148, as shown in. After performing the exposure two times, not subjected to development to form a layer (130).
机译:本发明用于将光敏树脂去除到比凹部中的光敏树脂的厚度小的厚度浅的深度,并且制造用于将光敏树脂留在除凹部以外的部分中的电光装置用基板,电光装置。在制造过程中,首先,如图5(a)所示,在第二基板120上形成感光性树脂涂层132。随后,如图5(b)所示,如图所示,由第一掩模版145进行第二次曝光以形成凹凸。此后,在除凹凸部分以外的部分,应将其去除至光敏树脂的深度,并去除膜的厚度。如图5(c)所示,如图所示,在第二秒内作为第二掩模版148进行两次曝光。在进行两次曝光之后,不进行显影以形成层(130)。

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