FRAGILE MATERIAL SUBSTRATE SCRIBER, FRAGILE MATERIAL SUBSTRATE PROCESSING MACHINE, FRAGILE MATERIAL SUBSTRATE POLISHING DEVICE, AND FRAGILE MATERIAL SUBSTRATE PARTING SYSTEM

摘要

The invention, scriber for a brittle material substrate; The brittle material substrate polishing apparatus characterized by grinding the side edges of the cut the brittle material substrate; And at least one brittle material scriber and scribing the brittle material brittle material substrate polishing a brittle material cutting system of the substrate characterized in that it comprises a device for the substrate is polished to the side edge of the cut the brittle material substrate after the cutting of the substrate as will in the cutting system of the flat display, a breaking step is omitted in order to respond to the increase in size of the substrate that is employed to configure the system by cutting a scriber and a polishing apparatus.