Method of regenerating test pattern for board level interconnection based on ground bounce effect and delay fault detection

摘要

The present invention solves the connection line test and the GB problem, which is a problem of the conventional test pattern rearrangement method, and also proposes a test pattern rearrangement method capable of performing the delay failure test of the connection line perfectly in any case. In order to simultaneously consider the boundary scanning malfunction due to the GB effect and the detection of delay failure of the connection line, it is necessary to generate a test pattern that can detect the delay failure of the connection line while satisfying all functions provided by the conventional method. To this end, the present invention proposes an algorithm in which a codeword selection process, which is a first stage of the existing GB problem, is applied as it is, and a second stage of test pattern rearrangement is changed.;Ground bounce, ground bounce, GB, boundary scan, test pattern