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MEASUREMENT METHOD OF DEPOSITION THICKNESS, FORMATION METHOD OF MATERIAL LAYER, DEPOSITION THICKNESS MEASUREMENT DEVICE AND MATERIAL LAYER FORMATION DEVICE
MEASUREMENT METHOD OF DEPOSITION THICKNESS, FORMATION METHOD OF MATERIAL LAYER, DEPOSITION THICKNESS MEASUREMENT DEVICE AND MATERIAL LAYER FORMATION DEVICE
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机译:沉积厚度的测量方法,材料层的形成方法,沉积厚度的测量装置和材料层的形成装置
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摘要
Light emitted from a light emitting device is irradiated onto a film thickness monitoring region and the light conveyed from the monitoring region is detected by a light receiving device. The light emitting device and the light receiving device may be provided within the film forming chamber. The absorption intensity or fluorescence intensity or X ray intensity or the reflection rate at the monitoring region which is formed on a portion of the substrate from the same material as the material layer at the time of deposition is detected based on data from the light receiving device. A controller then controls the transporting rate of a deposition source and/or the heating state of a heater to adjust the deposition rate, whereby a material layer having a desired thickness is formed on the substrate.
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