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Method for Annealing Silicon Thin Films Using Conductive Layer and Polycrystalline Silicon Thin Films Prepared Therefrom

机译:使用导电层对硅薄膜进行退火的方法以及由此制备的多晶硅薄膜

摘要

The present invention provides a method of annealing silicon thin film, which comprises providing a conductive layer underneath a silicon thin film, applying an electric field to the conductive layer to induce Joule heating and thereby to generate intense heat, and carrying out crystallization, elimination of crystal lattice defects, dopant activation, thermal oxidation and the like, of the silicon thin film; and a polycrystalline silicon thin film having high quality prepared by the method. The annealing method of the invention provides a polycrystalline silicon thin film which has virtually no crystal lattice defects, which is completely free from contamination by catalyst metal appearing in polycrystalline silicon thin films produced by crystallization methods such as MIC and MILC, and at the same time, is not accompanied by surface protrusions appearing in polycrystalline silicon thin films produced by ELC, while not incurring thermal deformation of glass substrate.
机译:本发明提供一种对硅薄膜进行退火的方法,该方法包括:在硅薄膜下方提供导电层;向该导电层施加电场以引起焦耳热,从而产生强热;以及进行结晶,消除硅的产生。硅薄膜的晶格缺陷,掺杂剂活化,热氧化等;通过该方法制备的高质量的多晶硅薄膜。本发明的退火方法提供了一种几乎没有晶格缺陷的多晶硅薄膜,该薄膜完全不受由诸如MIC和MILC之类的结晶方法生产的多晶硅薄膜中同时出现的催化剂金属的污染。在由ELC生产的多晶硅薄膜中,不存在表面突起,而不会引起玻璃基板的热变形。

著录项

  • 公开/公告号KR100729942B1

    专利类型

  • 公开/公告日2007-06-19

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20050073076

  • 发明设计人 홍원의;노재상;

    申请日2005-08-10

  • 分类号H01L21/324;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:56

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