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LIFT PIN LEVELERS AND METHODS OF ALIGNING LIFT PIN USING THE SAME

机译:提升销等级和使用相同方式提升提升销的方法

摘要

Lift pin levelers and methods for aligning lift pins using the same are provided to maintain an alignment state between a substrate receiving body and a semiconductor substrate during a semiconductor manufacturing process. A contacting body(20) is arranged to perform vertical movement by passing through an upper housing(30). The contacting body is screw-coupled to a part of the upper housing. A pressure body(60) passes through a middle housing(80) covered by the upper housing. The pressure body is arranged in the middle housing to perform vertical movement. The pressure body is screw-coupled to a part of the middle housing and the contacting body. An alignment body(140) is arranged in a lower housing(110) under the rest of the middle housing and the upper and middle housings. The alignment body has the same center as the contacting body and the pressure body. The alignment body is screw-coupled to a part of the pressure body.
机译:提供了升降销整平器以及使用升降销整平机和使用升降销整平机对准升降销的方法,以在半导体制造过程中保持基板容纳体与半导体基板之间的对准状态。接触体(20)被布置为通过上壳体(30)进行竖直运动。接触体螺纹连接到上部壳体的一部分。压力体(60)穿过由上壳体覆盖的中间壳体(80)。压力体布置在中间壳体中以执行竖直运动。压力体螺纹连接至中间壳体和接触体的一部分。对准体(140)布置在下部壳体(110)中的中间壳体的其余部分以及上部壳体和中间壳体的下方。对准体具有与接触体和压力体相同的中心。对准体螺纹连接到压力体的一部分。

著录项

  • 公开/公告号KR100735755B1

    专利类型

  • 公开/公告日2007-07-06

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20060016932

  • 发明设计人 KIM YOUNG DO;

    申请日2006-02-21

  • 分类号H01L21/683;

  • 国家 KR

  • 入库时间 2022-08-21 20:31:49

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