METHOD FOR BUNDLING THE SUPERCONDUCTING COATED CONDUCTORS AND BUNDLED SUPERCONDUCTING COATED CONDUCTOR

摘要

A method for bundling a thin film type superconducting wire and a bundled superconducting wire are provided to adhere an extra device to the superconducting wire or a metal stabilizer without influencing the superconducting wire. A method for bundling a thin film type superconducting wire(100) and the bundled superconducting wire includes the steps of: completing the thin film type superconducting wire(100) by depositing a buffer layer and a superconducting layer on an upper plane of the metal substrate by using a pulse laser deposition device or an evaporation deposition device; stacking the thin film type superconducting wire(100) in parallel; inserting a metal stabilizer(200) between thin film type superconducting wires(100); soldering the thin film type superconducting wire(100) and the metal stabilizer(200); passing the thin film type superconducting wire(100) soldered with the metal stabilizer(200) through a heating and pressing roller(10); and passing the thin film type superconducting wire(100) through resistance welding rollers(20) for welding each metal stabilizer(200).