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A process for the preparation of a photonic band gap - - - structure and component with a produced in such photonic band gap - - - structure

机译:一种制备光子带隙-结构的方法和具有这种光子带隙-结构的部件

摘要

A process for the preparation of a photonic band gap - - - structure (pbg - structure) on a substrate with the following process steps:– In conformity with respect to each other form a coplanar shafts conductors - metallizations (3; 3 '') on the surfaces of two substrates (1; 1'');– Contacting the relative to one another, which is constructed to conform to the coplanar shafts conductors - metallizations (3; 3 '') of the two substrates (1; 1''); and– structured etching back of the two substrates (1; 1 '') of the coplanar shafts conductors - metallizations (3; 3'') opposite surfaces of the two substrates (1; 1 '').
机译:一种通过以下步骤在基板上制备光子带隙---结构(pbg-结构)的方法:-彼此一致地形成共面轴导体-金属化层(3; 3'')在两个基板(1; 1'')的表面上; –相对于彼此接触,构造成符合共面轴导体-两个基板(1; 1')的金属化(3; 3) '); –共面轴导体的两个基板(1; 1'')的结构化回蚀-两个基板(1; 1'')相对表面的金属化(3; 3'')。

著录项

  • 公开/公告号DE102004022140B4

    专利类型

  • 公开/公告日2007-03-08

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20041022140

  • 发明设计人

    申请日2004-05-05

  • 分类号H01P11/00;H01P7/06;H01P1/20;

  • 国家 DE

  • 入库时间 2022-08-21 20:30:05

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