首页> 外国专利> Wire separation lapping method involves detecting operating parameters of feed rate, pendulum angle, wire tension and deflection angle and regulating one parameter during separation process, such that contact length of wire is kept constant

Wire separation lapping method involves detecting operating parameters of feed rate, pendulum angle, wire tension and deflection angle and regulating one parameter during separation process, such that contact length of wire is kept constant

机译:线分离研磨方法包括检测进给速度,摆角,线张力和偏转角的操作参数,并在分离过程中调节一个参数,以使线的接触长度保持恒定

摘要

The method involves guiding a wire for separation from plates of a work piece and subjecting the work piece with oscillating and feed motions. The wire and the work piece are engaged over a certain length and operating parameters of feed rate, pendulum angle, wire tension, wire deflection angle (17) are detected individually. One parameter is regulated during a separation process, such that contact length of the wire is kept constant.
机译:该方法包括引导金属丝以使其与工件的板分离,并使该工件经受振荡和进给运动。金属丝和工件在一定长度上啮合,进给速度,摆角,金属丝张力,金属丝偏转角(17)的工作参数被单独检测。在分离过程中调节一个参数,以使导线的接触长度保持恒定。

著录项

  • 公开/公告号DE102005026546A1

    专利类型

  • 公开/公告日2006-12-07

    原文格式PDF

  • 申请/专利权人 TECHNISCHE UNIVERSITAET DRESDEN;

    申请/专利号DE20051026546

  • 发明设计人

    申请日2005-05-31

  • 分类号B23D57/00;B24B37/00;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:57

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