Integrated magnetic sensor component for e.g. measuring magnetic field intensity, has contact surfaces electrically connected with flat conductors by flip-chip-contacts and homogenization disk attached between semiconductor chip and magnet

摘要

The component has a sensor semiconductor chip (3) measuring magnetic field strength, and including contact surfaces (13) on its active upper side. The contact surfaces are electrically connected with flat conductors (6) by flip chip contacts. A magnet (2) is attached to the flat conductors and the chip is arranged on the upper side of the magnet. A mold compound surrounds the chip, the magnet and parts of the conductors and has a common border with the chip. A soft-magnetic homogenization disk (12) is attached between the chip and the magnet. An independent claim is also included for a method of manufacturing a sensor component for measuring a magnetic field intensity.