首页> 外国专利> Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw

Electronics housing cooling body with cooling fins, useful in automobiles, is produced inexpensively from extruded profiled slabs, specifically of aluminum, by cutting to length using profiled circular saw

机译:在汽车中有用的带有散热片的电子设备外壳冷却体,是通过使用异形圆锯将其切成一定长度而由挤压成型的异型坯(特别是铝制)廉价生产的

摘要

Production of a cooling body with cooling fins, for an electronics housing, involves (a) preparing extruded profiled slabs (13) with mutually parallel cooling fins, (b) mutually orienting the slabs to give a surface with parallel cooling fins and (c) cutting the slabs to length, using a profiled circular saw (14) with a stepped profile, to give the cooling bodies.
机译:用于电子设备外壳的带有散热片的冷却体的生产涉及(a)准备具有相互平行的散热片的挤压型材板(13),(b)使这些板相互定向以提供具有平行散热片的表面,以及(c)使用具有阶梯轮廓的异形圆锯(14)将板切割成一定长度,以提供冷却体。

著录项

  • 公开/公告号DE102005043055B3

    专利类型

  • 公开/公告日2006-12-21

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE20051043055

  • 发明设计人 PFEUFFER VIKTOR;SMIRRA KARL;ZICH ROBIN;

    申请日2005-09-09

  • 分类号B23P13/04;B21C23/03;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:46

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