Micromechanical device for use in e.g. pressure sensor, has seismic mass that is connected by spring structure, and free space and cavity that are provided parallel to main substrate level and below front side surface

摘要

The device has a sensor structure including a spring structure (21) and a seismic mass (22). The seismic mass is connected by the spring structure with a substrate material (10). A free space (23) is provided in a direction perpendicular to a main substrate level (11) between the spring structure and the material or the spring structure, and the seismic mass has an integrated front side surface. An etch blocking layer such as silicon oxide, is formed in an area of the free space, where the space and a cavity (32) are provided parallel to the level and below the side surface. An independent claim is also included for a method for manufacturing a micromechanical device.