Power semiconductor module, has plastics material body with thermal coefficient of expansion of plastics material matched to that of circuit board

摘要

A power semiconductor module has at least one circuit board with a metal layer on a first side and forming part of the outer face of the module, and a second metal layer facing inward on a second side and fixed on the power semiconductor component and has a plastics material body, the plastics material (16) of which has a thermal coefficient of expansion corresponding to that of the circuit board (2).