首页> 外国专利> Device for embossing foil substrates for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll, heat conducting bodies and homogeneous temperable surfaces

Device for embossing foil substrates for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll, heat conducting bodies and homogeneous temperable surfaces

机译:用于压花箔基材的压花装置,用于生产微流体,生物技术,医学和化学领域的组件,该设备包括压花辊,导热体和均匀的可回火表面

摘要

The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. The device for embossing polymer foil substrates (1) for production of components in the areas of micro fluidics, biotechnology, medicine and chemistry, comprises an embossing roll (3), heat conducting bodies (9, 10) and homogeneous temperable surfaces (11). The foil substrates exhibit the embossing roll and a unit for supplying the foil substrate to the embossing roll. The heat conducting material of the body is metal and/or graphite. Distance of overlapping surfaces of both bodies is five times less than the foil substrate thickness. An embossing or overlapping region of the foil substrate is conductible between the surfaces by the supplying unit. The heat conducting bodies in conveying direction of the foil substrates are directly arranged before the embossing roll. Each of the heat conducting bodies exhibits a heat capacity, which is larger than the heat capacity of the overlapping surface of the embedded foil substrate. The temperable surfaces of both bodies are spaced apart from each other and overlap within a coherent lap region. The overlapping region exhibits a shape and size, which correspond to the shape and size of the embossing regions of the embossing die or the embossing regions of the embossing roll. The temperable surfaces are rectangular and exhibit a counter contour three-dimensional surface contour. The bodies exhibit a metal plate shape with a width, a length and a thickness. The plate thickness is more than 5 mm. A first overlapping surface corresponds to a part of a cylinder outer cover inner surface of a first cylinder with a cylinder diameter D1. A second overlapping surface corresponds to a part of a cylinder cover inner surface of a second cylinder with a cylinder diameter D2. The diameter D1 is less than the diameter D2. The device is intended a negative pressure system connected with one of the body and the foil substrate is suctionable at the surface of this body by means of negative pressure. Means is provided for the adjustment of predefinable distances between the overlapping surfaces of the body. A tempering system provided with the surfaces is formed in such a way that the surfaces are temperable at 0-250[deg]C with an accuracy of +-0.1[deg]K respectively. The tempering system is formed in such a way that one of the surfaces is temperable at temperature T1 greater than Tg and the other surfaces at temperature T2 less than Tg. The thermal energy of the bodies is supplyable in the form infrared radiation by means of inductive heating, electrical resistive heating or heat exchanger. The foil substrate is a foil laminate composed of two single foils, which exhibit different glass transitions. The device is operated cyclically and/or continuously.
机译:用于在微流体,生物技术,医学和化学领域对聚合物箔基材进行压花的设备(1)的装置,包括压花辊(3),导热体(9、10)和均匀的可回火表面(11) 。箔片基材具有压花辊和用于将箔片基材供应至压花辊的单元。主体的导热材料是金属和/或石墨。两个主体的重叠表面的距离比箔基板厚度小五倍。用于在微流体,生物技术,医学和化学领域对聚合物箔基材进行压花的设备(1)的装置,包括压花辊(3),导热体(9、10)和均匀的可回火表面(11) 。箔片基材具有压花辊和用于将箔片基材供应至压花辊的单元。主体的导热材料是金属和/或石墨。两个主体的重叠表面的距离比箔基板厚度小五倍。箔片基板的压纹或重叠区域可通过供应单元在表面之间导通。沿箔片基板的输送方向的导热体直接布置在压花辊之前。每个导热体表现出的热容大于嵌入的箔片基板的重叠表面的热容。两个车身的可回火表面彼此间隔开,并且在连贯的搭接区域内重叠。重叠区域呈现出形状和尺寸,该形状和尺寸对应于压花模具的压花区域或压花辊的压花区域的形状和尺寸。可回火的表面是矩形的,并呈现出反向轮廓的三维表面轮廓。主体呈现出具有宽度,长度和厚度的金属板形状。板厚度大于5毫米。第一重叠表面对应于具有气缸直径D1的第一气缸的气缸外盖内表面的一部分。第二重叠表面对应于具有气缸直径D2的第二气缸的气缸盖内表面的一部分。直径D1小于直径D2。该装置旨在为与主体之一连接的负压系统,并且箔片基板可通过负压在该主体的表面上抽吸。提供了用于调节主体的重叠表面之间的预定距离的装置。设置有表面的回火系统以这样的方式形成,使得该表面在0-250℃下可分别以±0.1°K的精度进行回火。回火系统形成为使得一个表面在温度T1大于Tg时可回火,而另一个表面在温度T2小于Tg时可回火。主体的热能可以通过感应加热,电阻加热或热交换器以红外辐射的形式提供。箔基材是由两个单箔组成的箔层压板,这两个箔表现出不同的玻璃化转变。该设备循环和/或连续地操作。

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