首页> 外国专利> - Process for plasma cutting using a secondary gas mixture consisting of at least two oxygen containing gases useful in plasma cutting, e.g. of metals avoids unwanted hardening of metal surfaces, pore formation and welding difficulties

- Process for plasma cutting using a secondary gas mixture consisting of at least two oxygen containing gases useful in plasma cutting, e.g. of metals avoids unwanted hardening of metal surfaces, pore formation and welding difficulties

机译:-使用由至少两种在等离子切割中有用的含氧气体组成的二次气体混合物进行等离子切割的方法,例如的金属避免了金属表面的不必要的硬化,孔的形成和焊接困难

摘要

Process for plasma cutting with a plasma cutting burner using a plasma gas or plasma gas mixture and a secondary gas mixture consisting of at least two oxygen containing gases. The first ocygen containing gas is oxygen and the second one is air, Cox or NxOx. The secondary gas mixture comprises both the first and second oxygen containing gases.
机译:用等离子体切割燃烧器进行等离子体切割的方法,该等离子体切割燃烧器使用等离子体气体或等离子体气体混合物以及由至少两种含氧气体组成的二次气体混合物。第一种含氧气的气体是氧气,第二种是空气,Cox或NxOx。二次气体混合物包括第一和第二含氧气体。

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