Semiconductor module with components for high-frequency methods in plastic housing especially for vehicle radar and satellite navigation has multilayer alternating conductive rail structure on the surface

摘要

A semiconductor module with components (6) for high-frequency operation in a plastic housing comprises a main surface (8) on top of a housing mass (10) and at least one active side (11) of a semiconductor chip with a multilayer connection rail structure (13) on the main surface comprising alternating insulation (16,17) and structured metal (14,15) layers. At least one of the insulation and/or housing mass comprises a highest frequency isolation region. Independent claims are also included for the following: (A) A module as above having a cooling body; (B) Production processes for the modules as above; (C) Distance-determining radar for a motor vehicle; (D) Satellite navigation apparatus; (E) A transponder;and (F) A motor vehicle comprising the above.