Heating device for depositing thin section, has flow channel production cover including inner area and glued at lower side of wafer support plate, on which wafer is seated, and suction hole formed between projections

摘要

The device has a wafer support plate (110), on which a wafer (W) is seated, where injecting holes (111) are arranged at an edge of the plate. A heat generating unit is contained in the plate. A shaft (120) is arranged at a lower side of the plate and has an inert gas channel, through which the inert gas is supplied. A flow channel production cover (130) is glued at the lower side and has an inner area (131), which is formed between the cover and the plate. The holes and the channel are connected with each other by the inner area. A suction hole (113) is formed between projections (112).